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| TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package SP0501BACT The product is a silicon P/N structure tailored for ESD protection and is offered in the standard EIA 0402 size. The single channel Chip Scale device is used to help protect sensitive digital or analog input circuits on data, signal, or control lines with voltage levels up to 5VDC. The bipolar device is ideal for protection where AC signals are present. The state-of-the-art device is designed to suppress ESD and other transient over-voltage events to meet the International Electrotechnical Compatability (EMC transient immunity stantards IEC 61000-4-2 for Electrosatic Discharge Requirements). The monolithic silicon device is comprised of specially designed structures for transient voltage suppression (TVS). The size and shape of these structures has been tailored for transient protection. The low capacitance and clamp voltage are ideal for high speed signal line protection. Ordering Information Part Number SP0501BACT Diode Channels 1 Bumps 2 Package Size mils (mm) 40x20 (1x 0.5) Quantity Per Reel 3500 5 Schematic SP0501BAC Applications * Cell phone handsets * Personal Digital Assistants (PDA) * Portable handheld equipment (Laptop, Palmtop computers) * Computer port, keyboard (USB1.1) * Set-Top Box (Audio and Video ports) Features * Single channel suppressor in an EIA 0402 device size * ESD Capability - IEC 61000-4-2, Direct Discharge .................................30kV (Level 4) - IEC 61000-4-2, Air Discharge ......................................30kV (Level 4) - MIL STD 883D (Method 3015.7).................................................30kV * Signal line protection for applications up to 5VDC * Fast response time .........................................................................< 1ns * Low input capacitance .........................................................30pF Typical * Low clamp voltage (8kV test) ................................................13V Typical * Low input leakage ....................................................1nA @ 3.3V Typical * Operating temperature range ............................................-40C to 85C * PCMCIA cards w w w. l i t t e l f u s e . c o m 219 TVS DIODE ARRAYS TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package SP0501BACT Electrical Specifications TA = 25C Unless Otherwise Specified PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during ESD MIL-STD 833D (Method 3015.7) ESD Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage -40 -65 85 150 C C 5V @ 1Mhz 30 30 30 <1 8kV 13 V V kV kV pF ns I = 10mA I = 10mA 6.0 -9.2 7.5 - 7.5 9.2 - 6.0 V V TEST CONDITIONS I = 10A V = 5.5V MIN 5.9 TYPICAL 1 MAX 100 UNITS V A Typical Device Capacitance vs. Voltage 50 Outline Drawing 40 30 20 0.076 (.003") 1.0 (.04") 0.076 (.003") 0.36 (.014") 0.5 (.02") 10 0 0.36 (.014") 0.076 (.003") 0 1 2 3 4 5 0.15 (.006") NOTE** Metal Bump: 63/37 (Sn/Pb) alloy Voltage Across Device (V) 220 w w w. l i t t e l f u s e . c o m TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package SP0501BACT Printed Circuit Board Recommendations Pad Size in PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Type Board Trace Finish 14 x 6 mils (0.356 x 0.152mm) Rectangle Non Solder Mask Defined Pads (NSMD) 18 x 10 mils (0.457 x 0.254mm) 6 mils (0.152mm) 14 x 6 mils (0356 x 0.152mm) 50/50 No Clean Organic Solderable Preservative (OSP) (Enteck: Cu Plus 106A) 28 mils 2 mils Solder stencil opening/PCB land Solder Mask Opening 5 TVS DIODE ARRAYS 14 mils 18 mils 2 mils 6 mils 10 mils Typical Solder Reflow Thermal Profile (No-Clean Flux) 250 EXH PH Z2 Z3 Z4 Z RF CD EXH 225 200 Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 242 290 339 387 435 Time (s) w w w. l i t t e l f u s e . c o m 221 |
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